Everybody wants higher bandwidth on their enterprise networks, but higher bandwidth usually requires higher port densities, which increases both capital and operational costs.

Broadcom says it is looking to alleviate those concerns with a pair of new dual 10 GbE PHYs built on the 65 nm process.

Both the BCM8727 SFI-to-XAUI and the BCM8750 SFI-to-XFI devices are all-DSP CMOS designs that outperform the IEEE 802.3aq standard for multimode fiber applications, reports FoxBusiness.com. The company says they can simplify the migration process from 1 GbE operation to 10 GbE by leveraging the SPF+ form factor utilized by legacy solutions.

Both units also employ the company's Electronic Dispersion Compensation (EDC) equalizer technology and utilize an on-chip micro-controller to stabilize data flow in heavy-use environments. For line card applications, the chips use a multi-tap pre-emphasis system to make up for FR-4 board material loss.

Samples of both devices are available now in BGA, RoHS-compliant packages-- the 8727 in a 19x19mm configuration and the 8750 in a 12x12mm configuration.